Chip Scale Review. Current Issue Subscribe Now September October 2. Volume 2. 1, Number 5 Cover Photo. The photo shows a close up side view of the ablation area inside SUSS Micro. Tecs ELP3. 00 Excimer Laser stepper. A polyimidecoated silicon wafer is positioned beneath a stationary projection lens not visible. Bright ablation plumes are visible on the wafers surface as polyimide is directly removed by the projected mask pattern and with sub micron depth accuracy. Excimer laser ablation is a technology enabler and an attractive alternative to photolithography. Cover photograph courtesy of SUSS Micro. Tec SE.  Read the issue. Absolutely-Avocados-Cover-560x640.jpg' alt='Chip Magazine June 2013 Pdf' title='Chip Magazine June 2013 Pdf' />IEEE Electromagnetic Compatibility Magazine informs readers of activities in the IEEE EMC Society and educates members via practical technical papers and design tips. Yahoo Lifestyle is your source for style, beauty, and wellness, including health, inspiring stories, and the latest fashion trends. Download PDF     Subscribe. Industry News. As in prior years, the in depth presentations at this years IWLPC, covering a broad array of the industrys critical challenges, did not disappoint. A series of keynote presentations and papers included a couple of major announcements that will be discussed below. Of special note, several keynote speakers focused on heterogeneous integration and the added complexities of migration to large rectangular panels. The session presentations reported impressive progress in material science, manufacturing processes, new equipment, metrology, and testing. A few selected highlights, only limited by the allotted space, are included below. North Billerica, MA, USA, August 1. MRSI Systems, a leading manufacturer of fully automated, ultra precision, high speed die bonding and epoxy dispensing systems, is launching a new High Speed Die Bonder, MRSI HVM3, to support our photonics customers high volume manufacturing requirements. The MRSI HVM3 is in full production and we are shipping to customers worldwide. Barcelona, Spain August 3, 2. Nanusens has announced that its CMOS nano sensor technology has been successfully used to solve the problem of stiction in MEMS inertial sensors, which is a major source of failure for this type of sensor. Our first silicon nano sensor samples from GLOBALFOUNDRIES exceeded our expectations showing outstanding resilience to stiction, with the devices going through more than 1. G shocks, explained Nanusens CEO, Dr Josep Montany i Silvestre. And the sensitivity is an order of magnitude above what is needed for a motion sensor in most applications. St. Florian, Austria, August 2, 2. EV Group EVG, a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is celebrating the 2. Japan, EV Group Japan KK. Established in August 1. Yokohama, EV Group Japan has since expanded its presence to include offices in Fukuoka and a state of the art applications lab in Yokohama for process and product demonstrations, as well as increased the number of employees in the country by nearly three fold. LYON, France August 1, 2. Woodside Capital Partners International LLC, a global, independent investment bank and Yole Dveloppement SA Yole announce a joint venture. Yole will serve as a research partner for Woodside Capitals M A advisory practice, which provides strategic and financial advice to emerging growth companies in the technology sector. Austin, TX July 1. Mobile devices, specifically smartphones, represent the single greatest volume driver for MEMS and other sensors today. Sensors found in these products include electronic compasses, motion sensors, barometers, microphones, and fingerprint sensors. Package types include land grid arrays LGAs, leadframe packages such QFNs, and wafer level packages WLPs. Apple is expected to account for 2. With the trend toward smart factories, industrial applications are also expected to account for increased sensor demand. July 1. 1, 2. 01. Tokyo, Japan BUSINESS WIRE Toshiba Memory Corporation, the world leader in memory solutions, today announced development of the worlds first1 Bi. CS FLASH three dimensional 3. D flash memory2 utilizing Through Silicon Via TSV3 technology with 3 bit per cell triple level cell, TLC technology. Shipments of prototypes for development purposes started in June, and product samples are scheduled for release in the second half of 2. The prototype of this groundbreaking device will be showcased at the 2. Flash Memory Summit in Santa Clara, California, United States, from August 7 1. Industry Events Milpitas, CA September 2. As the growing need to integrate disparate semiconductor technologies in a cost effective way with rapid cycle time and the driving demands of our increasingly connected world, we find many key hurdles in mainstreaming heterogeneous technology packaging solutions. In particular, this event will explore three issues central to the successful execution of heterogeneous integrated packages. Tommy`S Honour 2017 Online Trailer. GRENOBLE, France August 2. STMicroelectronics CEO Carlo Bozotti will kick off SEMI and MEMS Sensors Industry Groups MSIG co located European MEMS Sensors Summit 2. European Imaging Sensors Summit September 2. Grenoble, France with his keynote on the next wave of sensors and actuators in smart connected devices. CEA Leti CEO Marie Noelle Semeria will share her vision on the future of image sensing combined with other innovative sensors for augmented reality AR and virtual reality VR. EON Reality CEO Mats Johansson will explore pervasive and contextual AR and VR. Fraunhofer Institute for Photonic Microsystems IPMS Director Hubert Lakner will discuss the creation of a new cooperative German research fab that will strengthen the European microelectronics industry. These are just a few of the European technology leaders who will consider how MEMS, sensors, and imaging technologies are advancing the human experience with diverse applications in every imaginable technology sector. Raleigh, North Carolina October 9 1. The International Microelectronics Assembly and Packaging Society IMAPS will host the 5. Annual International Symposium on Microelectronics at the Raleigh Convention Center. You will find IMAPS 2. Sensing the world, SEMI Europe Imaging Sensors Summit 2. Each session will provide vision and information on current and next generation products, processes, and solutions driving the success of imaging applications forward. Bib. 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